These are compact, single-board AI development kits by AAEON (UP brand), designed for edge computing, machine vision, robotics, and industrial AI solutions. Each kit includes the board, a USB HD camera, RAM and storage, and comes pre-installed with Ubuntu Pro 24.04 LTS plus the NX AI Manager software and UP AI Toolkit for model deployment, benchmarking, and unified runtime setup.
Previously, we have covered only the UP Xtreme ARL developer board, but this time, you can find out about two other boards. You can check it out for your further reference.
UP TWL AI Dev Kit (Entry-Level)
A cost-effective, power-efficient entry option, the UP TWL kit uses the Intel Processor N150 (“Twin Lake”) with 4 cores/threads running up to 3.6 GHz (6 MB cache, 6 W TDP), along with integrated Intel UHD graphics (24 EUs). It includes 8 GB RAM, 64 GB eMMC storage, onboard FPGA (Intel Altera Max V), TPM 2.0, and UEFI BIOS features like Wake-on-LAN and PXE.
UP Squared Pro TWL AI Dev Kit (Mid-Range)
Built on the same Intel N150 foundation, this mid-tier kit extends AI capability via plug-in M.2 AI accelerators, including Hailo-8L, DEEPX DX-M1, or Axelera Metis modules, enabling up to 214 TOPS of AI inferencing power (depending on the module). Other enhancements: better I/O, especially for vision, includes a 61-pin FPC connector for MIPI-CSI cameras, USB 3.2 Gen 2, dual 2.5GbE LAN, triple 4K displays (via HDMI 2.0b, DP 1.2 and DP 1.4a), 8 GB RAM, 64 GB eMMC, TPM 2.0, and a 101.6 × 101.6 mm form factor.
UP Xtreme ARL AI Dev Kit (High-End)
This flagship kit is powered by the Intel Core Ultra 5 225H (“Arrow Lake”), featuring 14 CPU cores and Intel Arc 130T GPU plus an integrated NPU, delivering up to 83 TOPS native performance. You can add additional accelerators for further AI capability. It features robust I/O and industrial-ready design: 40-pin GPIO, RS-232/422/485 headers, MIPI-CSI camera support, multiple high-speed USB ports, dual LAN, wide voltage input (9–36 V), lockable DC jack, TPM 2.0, RTC, and a compact yet rugged ~120 × 122 mm board. Display outputs support up to four screens via HDMI 2.1 and DP 2.1.
Here’s a clear comparison table of the three UP AI Dev Kits with their main specifications:
| Specification | UP TWL AI Dev Kit | UP Squared Pro TWL AI Dev Kit | UP Xtreme ARL AI Dev Kit |
|---|---|---|---|
| Processor | Intel Processor N150 (Twin Lake, 4C/4T, up to 3.6 GHz, 6 MB cache, 6 W TDP) | Intel Processor N150 with support for external AI accelerators (Hailo-8L, Axelera Metis, DEEPX DX-M1) | ntel Core Ultra 5 225H (Arrow Lake, 14 cores, integrated NPU + Arc 130T GPU) |
| GPU | Intel UHD Graphics (24 EUs) | Intel UHD Graphics (24 EUs) | Intel Arc GPU + NPU |
| AI Performance | Basic AI with CPU/GPU | Up to 214 TOPS with AI accelerator modules | Up to 83 TOPS native (97 TOPS with Ultra 7 config) |
| Memory | 8 GB LPDDR5 | 8 GB LPDDR5 | Up to 64 GB LPDDR5 |
| Storage | 64 GB eMMC | 64 GB eMMC + M.2 NVMe support | Multiple storage options: eMMC, SATA, NVMe (M.2) |
| Camera Support | USB HD camera (included) | USB HD camera + 61-pin MIPI-CSI connector | USB/MIPI-CSI camera support |
| Display Outputs | Up to 2 displays (HDMI, DP) | Triple 4K displays (HDMI 2.0b, DP 1.2, DP 1.4a) | Up to 4 displays (HDMI 2.1, DP 2.1) |
| Networking | 1× GbE LAN | 2× 2.5 GbE LAN | Dual LAN (GbE/2.5 GbE depending on SKU) |
| Wireless Options | Optional via M.2 (Wi-Fi/BT modules) | Optional via M.2 (Wi-Fi/BT modules) | Optional via M.2 (Wi-Fi 6/6E, Bluetooth, 4G/5G modules) |
| I/O & Expansion | USB 3.2, USB 2.0, GPIO header | USB 3.2 Gen 2, GPIO, dual LAN, M.2 for AI | Rich I/O: 40-pin GPIO, RS-232/422/485, USB 3.2, dual M.2 slots, SATA |
| Security | TPM 2.0 | TPM 2.0 | TPM 2.0 |
| Power | Low-power (6 W TDP CPU) | 12 V DC input | Wide 9–36 V input, lockable DC jack |
| Size | 101.6 x 101.6 mm | 101.6 x 101.6 mm | 120 x 122 mm |
All UP AI Dev Kits ship with Ubuntu Pro 24.04 LTS, NX AI Manager, and the UP AI Toolkit for easy model deployment and benchmarking. The entry-level UP TWL AI Dev Kit supports lightweight AI with Intel N150 and OpenVINO. The UP Squared Pro TWL AI Dev Kit adds seamless support for external accelerators like Hailo-8L or Axelera Metis, scaling performance up to 214 TOPS. The high-end UP Xtreme ARL AI Dev Kit uses Intel Core Ultra CPUs with integrated GPU and NPU, optimised by OpenVINO and expandable via M.2 modules for advanced edge AI.
At the time of writing, the UP AI single-board development kits are now available at different price points depending on performance and features. Retailers price the entry-level UP TWL AI Dev Kit at $279, but they currently list it as “Schedule TBD,” meaning it’s not yet in stock and may be open for pre-orders. The mid-range UP Squared Pro TWL AI Dev Kit starts at $469, with the final cost depending on which AI accelerator module is included, such as the Hailo-8L, DEEPX DX-M1, or Axelera Metis. For those needing higher performance, the UP Xtreme ARL AI Dev Kit is available at $899 and is already in stock, offering immediate access to its advanced capabilities.
Sayantan Nandy 